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  this is information on a product in full production. november 2012 doc id 023771 rev 1 1/8 8 FERD30M45C st advanced rectifier datasheet ? production data features advanced rectifier proprietary process stable leakage current over reverse voltage low forward voltage drop high frequency operation description this dual center tap field effect rectifier provides stable leakage current over the full range of reverse voltage and low forward voltage drop. packaged in to-220ab or d 2 pak, this device is intended to be used in solar bypass junction boxes and in switch mode power supplies. table 1. device summary symbol value i f(av) 2 x 15 a v rrm 45 v t j (max) +175 c up to 200 c forward mode v f (typ) 0.35 v a1 a2 k a1 k a2 a1 k a2 to-220ab FERD30M45Ct d 2 pa k FERD30M45Cg www.st.com
characteristics FERD30M45C 2/8 doc id 023771 rev 1 1 characteristics when diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode 1) x r th(j-c) (per diode) + p(diode 2) x r th (c) table 2. absolute ratings (limiting values, per diode, at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) forward rms current 30 a i f(av) average forward current, ? = 0.5 t c = 155 c per diode per device 15 30 a t c = 155 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 250 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature 175 c t j maximum operating temperature (dc forward current without reverse bias, t = 1 hour) (1) 200 c 1. condition to avoid thermal runaw ay for a diode on its own heatsink. dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ? table 3. thermal resistance symbol parameter value (max) unit r th(j-c) junction to case per diode 1.6 c/w total 1.05 r th(c) coupling 0.5
FERD30M45C characteristics doc id 023771 rev 1 3/8 to evaluate the conduction losses use the following equation: p = 0.27 x i f(av) + 0.012 i f 2 (rms)) table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 600 a t j = 125 c 25 50 ma v f (2) forward voltage drop t j = 125 c i f = 7.5 a 0.305 0.350 v t j = 125 c i f = 10 a 0.350 0.395 t j = 25 c i f = 15 a 0.420 0.470 t j = 125 c 0.420 0.450 1. pulse test: t p = 5 ms, ? < 2% 2. pulse test: t p = 380 s, ? < 2% figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( ? = 0.5, per diode) 0 2 4 6 8 10 12 0 2 4 6 8 101214161820 p f(av) (w) i f(av) (a) t =tp/t tp = 0.05 = 0.1 = 0.2 = 0.5 = 1.0 0 2 4 6 8 10 12 14 16 18 0 25 50 75 100 125 150 175 t amb (c) i f(av) (a) t =tp/t tp r r t t h h ( ( j j - - a c ) ) = figure 3. junction capacitance versus reverse voltage applied (typical values, per diode) figure 4. forward voltage drop versus forward current (per diode) c(pf) 100 1000 10000 1 10 100 v r (v) f=1 mhz v osc =30 mv rms t j =25 c 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 v fm (v) i fm (a) t j =25c (maximum values) t j =125c (maximum values) t j =125c (typical values)
characteristics FERD30M45C 4/8 doc id 023771 rev 1 figure 5. relative variation of thermal impedance junction to case versus pulse duration figure 6. reverse leakage current versus reverse voltage applied (typical values, per diode) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 t p (s) to-220ab, d 2 pa k single pulse i rm (a) m 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 v r (v) t j =125 c t j =25 c t j =150 c t j =85 c
FERD30M45C package information doc id 023771 rev 1 5/8 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 to 1.0 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 7. footprint (dimensions in mm) table 5. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
package information FERD30M45C 6/8 doc id 023771 rev 1 d table 6. to-220ab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
FERD30M45C ordering information doc id 023771 rev 1 7/8 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode FERD30M45Ct FERD30M45Ct to-220ab 2.2 g 50 tube FERD30M45Cg-tr FERD30M45Cg d 2 pa k 1.5 g 1000 tape and reel table 8. document revision history date revision changes 12-nov-2012 1 initial release.
FERD30M45C 8/8 doc id 023771 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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